Board-to-Board Solutions: BoardCon
Board-to-board solution with secure processing and varibility
can be realized with the connector series Board-Con. The full automatic manufacturing process and control achieves the reliability for the assembly process and the funnction in modern subassemblies. The flexibility in the BoardCon manufacturing process allow for customized board-to-board solutions
can be realized with the connector series Board-Con. The full automatic manufacturing process and control achieves the reliability for the assembly process and the funnction in modern subassemblies. The flexibility in the BoardCon manufacturing process allow for customized board-to-board solutions
BoardCon Board-to-Board solutions
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Parallel applications
Board SMT horizontal/Board SMT horizontal -
Right angle applications
Board SMT horizontal/Board solder pin vertical -
Daughter card applications
Board solder pin vertical/Board solder pin vertical
Board solder pin vertical/Board pressfit vertical
Board pressfit vertical/Board pressfit vertical
Technical Features
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Termination style: SMT 90°, solder pin 180° ,solder pin 90° , pressfit 180°
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Pitch: 1 mm up to 5,08 mm
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Pin number: 2-50 per row
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Number of rows: 1 up to 3 rows
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High temperature plastics for SMT reflow process
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Tape-on-reel packaging for fully automatic
SMT assembly process
